Our Product Categories
With nearly two-and-a-half decades of experience in the field of microelectronic hermetic packages, our clients have access to the vast network of qualified suppliers and engineers we have built relationships with up over the years.
Optoelectronic Packages must achieve the twin goals of minimizing insertion loss while maintaining structural integrity in harsh environments.
For projects where high thermal dissipation is crucial, Power Packages are essential to protect sensitive electronics on the inside.
Sensor Packages must stand up to relentless vibration, mechanical pressing, and thermal shock whilst consistently relaying information from its delicate electronics.
Dual Inline (DIP) and Quad Inline Packages for Hybrid Integrated Circuits offer solutions for projects where plug-in installation is feasible.
TO headers offer connectivity and encapsulation solutions for a wide array of applications from basic electronic circuits to advanced semiconductors.
SMD packages enable users to mount electronic components directly onto the surface of printed circuit boards and come in standardized sizes or can be customized down to an extremely miniaturized scale.
We sell an enormous range of hermetic packages for OEMs in a variety of fields.
With nearly two and a half decades of production experience, our industry knowledge is almost unparalleled domestically. In that time we have also forged a network of trusted partners that enable us to source many hard-to-find parts and materials at competitive pricing. Our customers can take advantage of all this to control quality and cost.
Many of our customers at the R&D stage can utilize the services of our in-house engineers to help them solve design issues they encounter. Our engineers can also provide suggestions on materials or offer solutions from our catalog of open-tooling products that may be more feasible for your application than a custom design.