• The M1404 Ceramic Packages represent the pinnacle of hermetic ceramic packaging solutions.
  • These meticulously engineered packages combine the best of both worlds, seamlessly integrating metal and ceramic elements.
  • With their hermetic ceramic package design, they offer unparalleled protection and reliability for sensitive electronic components.
  • The M1404 Ceramic Packages are meticulously crafted to ensure optimal performance and durability in demanding environments.
  • Their superior quality and innovative design can safeguard your electronic devices with unwavering precision.
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M1404 Ceramic Packages Information

The Ceramic Package series, including CLCC, CQFP, CPGA, CBGA, CDIP, CFP, MCM, and CLCC, offers a diverse range of hermetic ceramic packages. These ceramic packages find widespread applications in computers, radar systems, communication equipment, and aerospace technologies.


Their robust construction ensures optimal protection for critical electronic components. With their exceptional reliability and durability, ceramic Packages are the preferred choice for demanding industries. The seamless integration of metal and ceramic materials delivers superior performance and safeguard your electronic systems.


Main Application

Ceramic packages find widespread use in computers, radar systems, communication equipment, and aerospace applications. These metal and ceramic packages offer exceptional advantages such as superior air tightness, high thermal conductivity, excellent mechanical strength, high insulation resistance, and a thermal expansion coefficient that is compatible with chip materials.


Why Choose Hermetix?

Hermetix, one of the most trustworthy glass-to-metal seal manufacturers, is always dedicated to providing customers with the best quality hermetic packages worldwide. Being a metal packaging manufacturer in this field for decades, we know exactly what you want and will endeavor to satisfy your specific needs. Get to learn more about us:

  • Customized Design Communication Pioneer
  • Standard Quality Assurance
  • Safe Shipping
  • Professional After-Sales Service

  Base Ceramic Leads Solder
Materials 4J29 92%Al2O3 4J29 HLAg72Cu28
Plating Ni:2~11.43um   Au:≥4um
Dimensions L:14mm W:8.13mm H:1.65mm
Insulation resistance ≥1×109Ω (100V DC)
Hermeticity ≥1×10-3 Pa·cm3/s

With over two decades of experience helping clients move from prototype to commercialization, Hermetix customized engineering service offers immense value at the R&D stage. From material selection to pin configuration to sealing techniques, our engineers can provide various solutions to help you overcome the technical obstacles our clients face in the early phases of designing a new product. We can work from your drawings or ours while pinpointing ways to lower costs and improve functionality.


Customization Process

Hermetix Hermetix Optoelectronic Packaging process includes the following steps

Step 1: Understanding Client Needs

Hermetix engineers collaborate with clients to identify the project’s technical requirements and end-use.

Step 2: Design the Optoelectronic Packaging

Hermetix engineers draft technical drawings focusing on workability from the productions’ point of view and end-user, e.g., bonding and sealing requirements.

Step 3: Monitoring Production Progress

Hermetix keeps track of suppliers’ manufacturing processes, including updating clients on progress and ensuring lead times.

Step 4: Inspection + Shipping

Once products are finished, Hermetix will verify product compliance and ship.

Step 5: After-Sales Services

Hermetix ISO 9001 – Certified Quality Assurance team follows standardized procedures to address and remedy any quality issues immediately. 


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