Description
Main series：
CLCC, CQFP, CPGA, CBGA, CDIP, CFP, MCM, CLCC
Main applications:
Widely used in computers, radar, communication equipment, and aerospace.
| CSOP-3 | ||||
| Frame | Ceramic | Leads | Solder | |
| Materials | 4J29 | 92%Al2O3 | 4J29/Cu/4J29 | HLAg72Cu28 |
| (1:4:1) | ||||
| Plating | Ni：≥2um Au：4um | |||
| Dimensions | L：13.6mm W：10.95mm H：1.35mm | |||
| Insulation resistance | ≥1×1010Ω (100V DC) | |||
| Hermeticity | ≥1×10-3 Pa·cm3/s | |||
With over two decades of experience helping clients move from prototype to commercialization, Hermetica’s customized engineering service offers immense value at the R&D stage. From material selection to pin configuration to sealing techniques, our team of engineers can provide a variety of solutions to help you overcome the technical obstacles our clients face in the early phases of designing a new product. We can work from your drawings or ours while pinpointing ways to lower costs and improve functionality.
