glass to metal seal, plug-in package, kovar leads, SPCC housing with ceramic substrate, Au finishing on the leads.

  Housing  Leads  Lid Substrate Solder ring Insulators 
Materials   Kovar 4J42 95%Al2O3 HLAgCu28 BH-G/K 
Plating  Ni: 1.3~11.43μm, Au≥1.0μm Ni: 2~11.43μm
Dimensions    L:28mm ±0.1W:25mm±0.1, H:9mm±0.1
Insulation resistance   ≥1× 1010 Ω (500V DC)
Hermeticity   ≤  1 x 10-3  Pa * cm/s
Note Unspecified tolerances are ±0.2mm

With over two decades of experience helping clients move from prototype to commercialization, Hermetica’s customized engineering service offers immense value at the R&D stage. From material selection to pin configuration to sealing techniques, our team of engineers can provide a variety of solutions to help you overcome the technical obstacles our clients face in the early phases of designing a new product. We can work from your drawings or ours while pinpointing ways to lower costs and improve functionality.

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