glass to metal seal, TO package, Au finishing.

  Base  Leads  Cap Insulators  Solder ring
Materials   Kovar  Ni BH-G/K HLAg72Cu28
Plating  Ni: 4~11.43μm, Au≥0.8μm Ni: 4~11.43μm, Au≥1.0/1.3μm
Dimension Header:Φ14mm , Cap H:5mm
Insulation resistance   ≥1× 1010 Ω (500V DC)
Hermeticity   ≤  1 x 10-3  Pa * cm/s
Note Unspecified tolerances are ±0.2mm

With over two decades of experience helping clients move from prototype to commercialization, Hermetica’s customized engineering service offers immense value at the R&D stage. From material selection to pin configuration to sealing techniques, our team of engineers can provide a variety of solutions to help you overcome the technical obstacles our clients face in the early phases of designing a new product. We can work from your drawings or ours while pinpointing ways to lower costs and improve functionality.

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