Main Features

  • High production efficiency because the housing structure is formed by mechanical stamping process
  • Customized shapes of this sensor header
  • Two main leads of this to 46 header to satisfy your needs
  • Innovative lid sealing methods to ensure its performance
  • Multiple plating options to guarantee various applications
  • Customization is the best way to fulfill your specific requirements
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TO Header Information

Hermetix’s TO header provides wide-range of selection, reliable hermetic, and excellent thermal management. For instance, this TO 46 header has high production efficiency and is, therefore, suitable for mass production of products. We guarantee fast turnaround for prototyping and are highly reliable for mass production.

This glass to metal seal to header provides you with various materials to choose from, and the shape of this sensor header can be customized according to your specific needs.



The Benefits of This Optoelectronic Packaging

Good Heat Dissipation Performance: TO headers are often designed with metal heat sinks that help dissipate heat generated by the enclosed electronic components, ensuring reliable and stable operation.

Easy Assembly: TO headers, like TO 46 headers, typically have a simple, two-pin design that makes it easy to assemble and install the connected components.



Plating Options

  • Base Au-plated, lid Ni-plated
  • Base partially Au-plated, lid Ni-plated
  • Base Au- plated, lid Au-plated



Main Applications

TO headers are used in almost all areas of microelectronic packaging applications on both the transmitter side (TOSA) and the receiver side (ROSA).


to header


Why Choose Hermetix?

Hermetix, one of the most trustworthy TO header manufacturers, is always dedicated to providing customers with the best quality hermetic packages worldwide. Being a metal packaging manufacturer in this field for decades, we know exactly what you want and will endeavor to satisfy your specific needs. Get to learn more about us:

  • Customized Design Communication Pioneer
  • Standard Quality Assurance
  • Safe Shipping
  • Professional After-Sales Service

Acclaimed laser butterfly package from Hermetix

  Base  Leads  Insulator  Solder ring 
Materials   4J29 4J29 DM-305 HLAgCu28
Plating  Ni:1.3~8.9μm, Au:≥0.7μm
Insulation resistance   ≥1× 109Ω (500V DC)
Hermeticity   ≤  1 x 10-3  Pa * cm/s
Note Unspecified tolerances are ±0.2mm




With over two decades of experience helping clients move from prototype to commercialization, Hermetix customized engineering service offers immense value at the R&D stage. From material selection to pin configuration to sealing techniques, our engineers can provide various solutions to help you overcome the technical obstacles our clients face in the early phases of designing a new product. We can work from your drawings or ours while pinpointing ways to lower costs and improve functionality.


Customization Process

Hermetix Hermetix TO header process includes the following steps

Step 1: Understanding Client Needs

Hermetix engineers collaborate with clients to identify the project’s technical requirements and end-use.


Step 2: Design the Optoelectronic Packaging

Hermetix engineers draft technical drawings focusing on workability from the productions’ point of view and end-user, e.g., bonding and sealing requirements.


Step 3: Monitoring Production Progress

Hermetix keeps track of suppliers’ manufacturing processes, including updating clients on progress and ensuring lead times.


Step 4: Inspection + Shipping

Once products are finished, Hermetix will verify product compliance and ship.


Step 5: After-Sales Services

Hermetix ISO 9001 – Certified Quality Assurance team follows standardized procedures to address and remedy any quality issues immediately. 


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