glass to metal seal, TO package , Kovar housing, 2+1 Kovar leads, Au finishing.

  Base  Leads  Insulator  Solder ring 
Materials   4J29 4J29 BH-A/K HLAgCu28
Plating  Ni:2.5~11.43μm, Au:≥0.7μm
Diameter  Φ9.14mm+0.06-0.1mm
Insulation resistance   ≥1× 109Ω (500V DC)
Hermeticity   ≤  1 x 10-3  Pa * cm/s
Note Unspecified tolerances are ±0.2mm





With over two decades of experience helping clients move from prototype to commercialization, Hermetica’s customized engineering service offers immense value at the R&D stage. From material selection to pin configuration to sealing techniques, our team of engineers can provide a variety of solutions to help you overcome the technical obstacles our clients face in the early phases of designing a new product. We can work from your drawings or ours while pinpointing ways to lower costs and improve functionality.