glass to metal seal, TO package, Au finishing.
| To-8A-1H | |||||
| Base | Leads | Cap | Insulators | Solder ring | |
| Materials | Kovar | Ni | BH-G/K | HLAg72Cu28 | |
| Plating | Ni: 4~11.43μm, Au≥0.8μm | Ni: 4~11.43μm, Au≥1.0/1.3μm | |||
| Dimension | Header:Φ14mm , Cap H:5mm | ||||
| Insulation resistance | ≥1× 1010 Ω (500V DC) | ||||
| Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s | ||||
| Note | Unspecified tolerances are ±0.2mm | ||||
With over two decades of experience helping clients move from prototype to commercialization, Hermetica’s customized engineering service offers immense value at the R&D stage. From material selection to pin configuration to sealing techniques, our team of engineers can provide a variety of solutions to help you overcome the technical obstacles our clients face in the early phases of designing a new product. We can work from your drawings or ours while pinpointing ways to lower costs and improve functionality.