Gold-tin lid series (spot welded)

Gold-tin lid series (spot welded)

 

 

Description

widely used in hybrid integrated circuits, semiconductor integrated circuits, filter devices, microwave devices, high-power devices, connectors, and sensors.

Composition

Materials

Preset Solder Composition

Au80Sn20

Lid material

4J29, 4J42, molybdenum copper, ceramic, etc.

Lid plating

Ni/Au, Ni/Au/Ni/Au/
* Plating customized according to customer requirements

With over two decades of experience helping clients move from prototype to commercialization, Hermetica’s customized engineering service offers immense value at the R&D stage. From material selection to pin configuration to sealing techniques, our team of engineers can provide a variety of solutions to help you overcome the technical obstacles our clients face in the early phases of designing a new product. We can work from your drawings or ours while pinpointing ways to lower costs and improve functionality.

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