Partially Au plated lid series
Description
widely used in hybrid integrated circuits, semiconductor integrated circuits, filter devices, microwave devices, high-power devices, connectors, and sensors.
| Composition | Materials |
| Preset Solder Composition | Au80Sn20 |
| Lid material | 4J29, 4J42, molybdenum copper, ceramic, etc. |
| Lid plating | Ni/Au, Ni/Au/Ni/Au/ |
With over two decades of experience helping clients move from prototype to commercialization, Hermetica’s customized engineering service offers immense value at the R&D stage. From material selection to pin configuration to sealing techniques, our team of engineers can provide a variety of solutions to help you overcome the technical obstacles our clients face in the early phases of designing a new product. We can work from your drawings or ours while pinpointing ways to lower costs and improve functionality.
