Opto-electronic package, butterfly package, multi-piece structure, glass to metal seal


glass to metal seal, multi-piece structure, butterfly package, 16 rectangular shape leads , copper-tungsten base soldered to Kovar frame, with flange and fiber optic channel, Au finishing.

  Base   Frame Leads
Materials   W80Cu20 4J29
Plating  Ni:1.3~11.43μm, Au: 0.3μm
Dimensions   L:13.5mm,W:12.6mm,H:8mm
Insulation resistance   ≥1× 1010 Ω (500V DC)
Hermeticity   ≤  1 x 10-3  Pa * cm3 /s
Note Unspecified tolerances are ±0.2mm




With over two decades of experience helping clients move from prototype to commercialization, Hermetica’s customized engineering service offers immense value at the R&D stage. From material selection to pin configuration to sealing techniques, our team of engineers can provide a variety of solutions to help you overcome the technical obstacles our clients face in the early phases of designing a new product. We can work from your drawings or ours while pinpointing ways to lower costs and improve functionality.

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